NgoJulayi 11, umenzi wetshiphu waseNtaliyane i-STMicroelectronics (STM) kunye nomenzi wetshiphu waseMelika iGlobal Foundries babhengeze ukuba ezi nkampani zimbini zityikitye imemorandam yokwakha ngokudibeneyo i-wafer fab entsha eFransi.
Ngokwewebhusayithi esemthethweni ye-STMicroelectronics (STM), umzi-mveliso omtsha uza kwakhiwa kufutshane nomzi-mveliso okhoyo we-STM eCrolles, eFransi.Injongo kukwenza imveliso epheleleyo ngo-2026, ibe namandla okuvelisa ukuya kutsho kuma-620,300mm (i-intshi ezili-12) ngonyaka xa kugqitywe ngokupheleleyo.Iichips ziya kusetyenziswa kwiimoto, i-Intanethi yeZinto kunye nezicelo zeselula, kwaye umzi-mveliso omtsha uya kudala malunga ne-1,000 imisebenzi emitsha.
Ezi nkampani zimbini azizange zibhengeze isixa esithile sotyalo-mali, kodwa ziya kufumana inkxaso yemali ebalulekileyo kurhulumente waseFransi.Umzi-mveliso wendibaniselwano we-STMicroelectronics uya kubamba ama-42% ezabelo, kwaye i-GF iya kubamba i-58% eseleyo.Imarike ibilindele ukuba utyalo-mali kumzi-mveliso omtsha lungafikelela kwi-4 yeebhiliyoni zeeyuro.Ngokweengxelo zeendaba zangaphandle, amagosa karhulumente aseFransi athi ngoMvulo ukuba utyalo-mali lungadlula i-5.7 billion.
UJean-Marc Chery, umongameli kunye ne-CEO ye-STMicroelectronics, uthe i-fab entsha iya kuxhasa ingeniso ye-STM ekujoliswe kuyo ngaphezu kwe-20 yeebhiliyoni zeedola.Ingeniso ye-ST yemali ka-2021 yi-12.8 yeebhiliyoni zeedola, ngokwengxelo yayo yonyaka
Phantse iminyaka emibini, iManyano yaseYurophu ibikhulisa ukwenziwa kweetshiphu zalapha ekhaya ngokunikezela ngenkxaso-mali kurhulumente ukunciphisa ukuthembela kubaboneleli base-Asia kunye nokudambisa ukunqongophala kwetshiphu zehlabathi okuthe kwabangela umonakalo omkhulu kubenzi beemoto.Ngokwedatha yeshishini, ngaphezulu kwe-80% yemveliso yehlabathi yetshiphu okwangoku ise-Asia.
Intsebenziswano ye-STM kunye ne-GF yokwakha umzi-mveliso eFransi linyathelo laseYurophu lamva nje lokuphuhlisa ukuveliswa kwetshiphu ukunciphisa ikhonkco lokubonelela e-Asia nase-US njengenxalenye ephambili esetyenziswa kwizithuthi zombane kunye nee-smartphones, kwaye iya kuba negalelo kwiinjongo zeChip yaseYurophu. Umthetho igalelo elikhulu.
NgoFebruwari kulo nyaka, iKomishoni yaseYurophu iqalise "uMthetho weChip waseYurophu" kunye nesikali esipheleleyo se-43 yezigidigidi zee-euro.Ngokomthetho oyilwayo, i-EU iya kutyala imali engaphezulu kweebhiliyoni ezingama-43 kwiimali zoluntu kunye nezabucala ukuxhasa imveliso yetshiphu, iiprojekthi zolingo kunye nokuqalisa, apho i-euro eyi-30 yeebhiliyoni iya kusetyenziswa ukwakha iifektri ezinkulu ze-chip kunye nokutsala iinkampani zaphesheya. ukutyala imali eYurophu.I-EU iceba ukwandisa isabelo sayo semveliso ye-chip yehlabathi ukusuka kwi-10% yangoku ukuya kwi-20% ngo-2030.
I "EU Chip Law" ikakhulu iphakamisa imiba emithathu: okokuqala, isindululo "European Chip Initiative", oko kukuthi, ukwakha "iqela chip iqela ishishini" ngokuhlanganisa izixhobo ezivela EU, amazwe amalungu kunye namazwe afanelekileyo wesithathu kunye namaziko abucala umanyano olukhoyo., ukubonelela nge-11 yeebhiliyoni zee-euro ukomeleza uphando olukhoyo, uphuhliso kunye nokutsha;okwesibini, ukwakha isakhelo esitsha sentsebenziswano, oko kukuthi, ukuqinisekisa ukhuseleko lonikezelo ngokutsala utyalo-mali kunye nokwandisa imveliso, ukuphucula umthamo wonikezelo lweenkqubo eziphambili zechips, ngokubonelela ngeemali zokuqalisa Ukubonelela ngezibonelelo zemali kumashishini;okwesithathu, ukuphucula indlela yokulungelelanisa phakathi kwamazwe angamalungu kunye neKomishoni, ukubeka iliso kwikhonkco lexabiso le-semiconductor ngokuqokelela ubuntlola beshishini eliphambili, kunye nokuseka indlela yovavanyo lwentlekele ukuphumeza uqikelelo lwangethuba lonikezelo lwe-semiconductor, uqikelelo lwemfuno kunye nokunqongophala, ukuze impendulo ekhawulezayo ibe nokuphumelela. yenziwe.
Kungekudala emva kokuqaliswa kwe-EU Chip Law, ngoMatshi walo nyaka, i-Intel, inkampani ehamba phambili ye-chip yase-US, yabhengeza ukuba iya kutyala i-80 yezigidigidi zee-euro eYurophu kwiminyaka eyi-10 ezayo, kwaye isigaba sokuqala se-33 yebhiliyoni ye-euro iya kuthunyelwa. eJamani, eFransi, eIreland, eItali, ePoland naseSpain.amazwe ukwandisa umthamo wemveliso kunye nokuphucula izakhono zeR&D.Koku, i-17 yeebhiliyoni zeeyuro zatyalwa eJamani, apho iJamani ifumene i-6.8 yeebhiliyoni zeeyuro kwinkxaso.Kuqikelelwa ukuba ukwakhiwa kwesiseko sokwenza i-wafer eJamani ebizwa ngokuba yi "Silicon Junction" iya kuphuka kwisiqingatha sokuqala se-2023 kwaye kulindeleke ukuba igqitywe ngo-2027.
Ixesha lokuposa: Jul-12-2022